■ Keynote Speaker 1
Lirong Cui , PhD, Professor，
Beijing Institute of Technology
Title: Shock Damage Evolution Processes and Their Analyses
Time：July 23-26, 2025
Abstract: Shock models have been widely studied in reliability. Most related researches have focused primarily on damage effects of shocks treated as constants after the arrivals of shocks, which may not be true in some practice. Because of the presence of self-healing, deterioration, and variation over time, the damage effects caused by the shocks may have some self-evolutions. In this talk, we shall discuss the patterns of shock arrives first, then study several possible damage effects after shock arriving. Thirdly, the shock damage analyses including modelling, assessment and decision-making are considered based on the shock arriving patterns and damage effects. Finally, the presentation is concluded and the possible future research is proposed. The talk outlines not only the related studies, but also may shed light on the related depth researches and extensive applications.
Biography:
Lirong Cui is a distinguished professor and ISEAM fellow in Business School of Qingdao University. He graduated from Tianjin Polytechnic University in 1983 (Bachelor of Engineering), from Institute of Systems Science, Chinese Academy of Sciences in 1986 (Master of Science), and from University of Wales (Swansea) in 1994 (PhD in Probability and Statistics). He worked at the Ministry of Aerospace Industry of China from 1986 to 1999, at National University of Singapore from 2000 to 2022, and at the School of Management of Beijing Institute of Technology from 2003 to May 2021. He has been working in Qingdao University since May 2021. He worked as a visiting scholar in the UK and Taiwan. He was an associate editor of IEEE Transactions on Reliability for 10 years (2005.1-2015.9). He serves currently an associate editor of IISE Transactions, Communications in Statistics, Quality Technology & Quantitative Management. He was and/or is now the branch director and deputy director of several academic organizations. He has published more than 170 SCI indexed papers and 1 English monograph. In 2005, he was named the new century outstanding talents of the Ministry of Education. He has supervised more than 40 PhD students and nearly 300 master students in mathematical and/or management subjects. He has chaired (was and is now) 6 general programs and 1 key program of the National Natural Science Foundation of China. Three international conferences he organized were funded by the National Natural Science Foundation of China as well. At present, his main research interests are: system reliability, aggregated stochastic process and repairable system modeling, degradation system reliability, finite Markov chain embedding method, cascade failures, balanced system reliability, optimal matching, Hawkes process, stochastic differential equations in reliability, data-based modeling and analyses, etc.
■ Keynote Speaker 2
Jie Li, Academician of the Chinese Academy of Sciences，
Tongji University
■ Keynote Speaker 3
Changpu Sun, Academician of the Chinese Academy of Sciences，
China Academy of Engineering Physics
■ Keynote Speaker 4
Guo-guang Lu, Researcher,
China Electronic Product Reliability and Environmental Testing Research Institute
Title: Research on Failure Mechanism and Reliability Evaluation of TSV-Based 3D Integrated System
Time：July 23-26, 2025
Abstract: In the post-Moore era, advanced packaging technology have emerged as a primary pathway for achieving device miniaturization and high performance, positioning themselves at the forefront of global semiconductor industry competition and serving as a critical strategy for Chinese semiconductor industry to overcome technological barriers. Addressing the key challenges faced by Chinese current TSV-based 3D integration technology—including limitations in defect detection capabilities, ambiguities in failure mechanisms, and deficiencies in standardized evaluation methodologies—our research focuses on advancing the theory of collaborative non-destructive testing for internal defects in TSV-based 3D integration through multi-mechanism fusion. This work further explores the failure mechanisms of critical structural components and develops robust reliability evaluation methodologies. To address these challenges, we have successfully developed a comprehensive non-destructive testing and analysis platform for TSV-based 3D integrated devices, complemented by a reliability analysis and testing platform. Additionally, we have created reliability simulation software grounded in the physics of failure, enabling precise prediction and analysis of device behavior under various conditions. A reliability model database for key structures and devices has been constructed, providing a foundation for data-driven decision-making and optimization. These efforts have culminated in the establishment of a holistic quality and reliability evaluation technology system for TSV-based 3D integrated devices. The significance of these advancements lies in their potential to enhance the high-reliability application of domestically produced devices in critical equipment, thereby supporting the strategic goals of technological self-reliance and industrial competitiveness in China’s semiconductor sector. This work not only addresses emergent technical challenges but also contributes to the long-term sustainability and innovation of TSV-based 3D integrated circuit
Biography:
Researcher Lu Guoguang, Director of the National Key Laboratory of Component Reliability Technology, Chinese Electronics Product Reliability and Environmental Testing Research Institute. In recent years, he has undertaken nearly 20 national and ministerial-level major and key projects. His research achievements have won 1 first prize for technological progress in Guangdong Province,2 national innovative team awards,2 second prizes and 2 third prizes at the ministerial level, and 1 excellent patent award in Guangdong Province. He has been granted 6 invention patents and has published over 60 SCI and EI-indexed papers.
